Senior Researcher in Advanced Packaging Simulation and Design
Contract : Full-time/Fixed Term

Role Description
The Photonics Packaging and Systems Integration Group at the Tyndall Institute invites applications for the position of Senior Researcher in Advanced Packaging Simulation and Design. This role will involve establishing and coordinating the necessary capabilities and infrastructure to enable the simulation and design of optical, electrical, thermal and mechanical parameters in advanced photonic and electronic packages and subsystems. The selected candidate will also develop multi-physics models that combine optical, electrical, thermal and mechanical domains to enable a comprehensive package ‘digital twin’. This will include the use of state-of-the-art software tools, artificial intelligence and machine learning processes, and CAD layout tools, to enable the rapid transition of design concepts from complex theoretical models to fully packaged prototypes. Theoretical models will be optimised using experimental package samples, based on an iterative design cycle process. A key output from these activities will be to create packaging design rules and Assembly Design Kits (ADKs), enabling user access to the full range standardised packaging processes and technologies. Besides focusing on package technical design and simulation, the successful candidate will also support the development packaging economic or cost models which will provide valuable data on the choice of materials and process steps to be used in packaging production processes. The successful candidate will lead these efforts in technology development, while also managing a number of research projects, supervising early-career researchers and students, and collaborating with academic and industrial stakeholders.

Key Responsibilities

Assist the head of packaging to establish a simulation and design team.
Lead and manage activities in optical, electrical, thermal and mechanical simulation and design, including the day-to-day management of simulation and design researchers and students.
Develop multi-physics models that combine the optical, electrical, thermal and mechanical domains to enable a comprehensive package ‘digital twin’.
Work closely with packaging researchers and engineers in the lab to transition design concepts from theoretical models to fully packaged prototypes.
Prepare packaging Design Rules and Assembly Design Kits (ADKs) to enable user access to the full range of standardised packaging processes and technologies.
Develop cost models based on design, material and process parameters to guide the creation of efficient packaging production processes.
Lead and manage a portfolio of industry and EU-funded projects, ensuring timely delivery of outcomes and effective resource utilisation.
Champion and mentor early-career researchers and students, fostering a collaborative and innovative team environment.
Build relationships with stakeholders, including academic collaborators and industry partners, to drive impactful research and development.
Encourage and support writing of project proposals.
Prepare detailed technical reports and publications on research outcomes.
Ensure compliance with organisational Quality Management Systems, Health and Safety standards, and other regulations.
Participate in Education and Public Engagement activities, as required.
Ensure all activities are compliant with the Tyndall Quality Management system.
Ensure all activities are compliant with the required Health and Safety standards.
Carry out any additional duties as may reasonably be required within the general scope and level of the post.

Essential Criteria

PhD qualified with typically six years academic or industrial experience in the simulation and design of photonics and/or electronics components and systems.
Extensive expertise in photonics with relevant experience in optical device physics.
Electrical design experience.
Experience using state-of-the-art photonic and/or electronic simulation and design software.
Experience using AI and Machine Learning tools to optimise simulation and design processes.
Proven ability to manage large-scale research projects, such as industry or academic research projects.
A demonstrated ability to collaborate effectively within interdisciplinary teams.
Demonstrate success in winning or contributing to competitive project funding calls.
Strong communication skills, with experience presenting research at conferences and engaging with stakeholders.

Desirable Criteria

Experience with optical packaging processes, including alignment and bonding processes.
Experience with semiconductor device processing and testing.
Experience in securing external funding from public or private sources.
Experience participating in European-funded projects.
Experience managing early-career researchers and students.

Tyndall National institute has a proactive entrepreneurial culture and we welcome applications from candidates who possess entrepreneurial and creative skills/experience, including the creation of technology start-ups.

The appointment will be made on Admin III (Grade 6) B Scale €60,260- €71,946 p.a. Salary placement on appointment will be in accordance with the public sector pay policy and years of experience.

Informal enquiries can be made in confidence Peter O’Brien.
Closing date for applications for this position is 1pm 19th September 2025.

Application Instructions:
Please make sure to attach an up to date CV/Resume AND a brief motivation letter outlining how you meet the ‘Essential Criteria’ for this role.

A full candidate information pack is available to download by clicking here.

Please note that Garda vetting and/or an international police clearance check may form part of the selection process.
Please note that an appointment to posts advertised will be dependent on University approval, together with the terms of the employment control framework for the higher education sector.

At this time, Tyndall National Institute does not require the assistance of recruitment agencies.
Tyndall National Institute at University College, Cork is an Equal Opportunities Employer.

Senior Researcher in Advanced Packaging Simulation and Design

Job Description