Job Details:

Job Description:

The Wafer Packaging Manufacturing (WPM) SORT Test Engineering Organization in Leixlip is looking for motivated Module Process Engineer and Pack Ship/Integration Engineer to support its operations.

The engineers in this team work with worldwide and local Intel teams to sustain and improve product, process and equipment health in the automated wafer test process and to enhance the quality, reliability and manufacturing of the overall test operation.
The successful candidates will have the opportunity to influence and optimize the test and processing environment for some of the most advanced CPU and System-On-A-Chip (SOC) products in the market. They will gain an understanding of Intel's chip architectures, test methods and processing flow in an environment that fosters and rewards technical innovation.

Responsibilities include but are not limited to

Continuous technical learning about the Intel's Test Platforms - incl. Semiconductor logic tester, 300mm wafer handler, probe card interface, test program and SW applications / embedded controllers, Integration flows and Sort systems.
Working with cross functional teams on investigation and debug of test platform failures - Electrical, Process, Mechanical, Optical, S/W.
Containment and disposition of production material impacted by such failures (production material = ICs under test).
Data mining (writing scripts to extract data) and data analysis of test results and tool logs to early-detect performance issues with the Test Platforms.
Statistical analysis of IC parametric test-results across the fleet of test equipment to detect discrepant equipment.
Investigation of parametric signals and correlate to test circuitry or mechanical/optical system - to isolate failing H/W.
Provide a point of escalation for technicians experiencing problems in their process/equipment debug activities.
Coach technicians on debug activities - document investigations and creation of debug content (instruction manuals and videos) for the technicians to improve performance of repair team.
Project managing new-product readiness - new test-methods - equipment upgrades/conversions and debug of test marginalities on new products.
Work with other engineering groups to improve overall performance of testing.
Managing the spares portfolio for the equipment and coordinating spares repair loops.
Manage Equipment performance, availability and can troubleshoot failures in a timely manner to ensure availability goals are met.
Develop scripts and processes to optimize test activities - often in collaboration of other international Intel sites.
Collaborate with Intel sites internationally on the continuous improvement of the Test Environments to stay ahead of latest technology demands (releasing, testing, contributing content to new products and test capabilities) - Scripts, procedures , debug methods.
Continuous learning about Intel products, IC test methodologies, new languages, and debug methods - applying this knowledge in the debug of evolving product signals.
Understanding and improvement of Sort Integration and Shipping systems.
Understanding of Sort Systems and Supply Chain operations.

Qualifications:

Qualifications:

A minimal qualification of honors degree (NFQ Level 8) in Electronics, Mechatronics, Electrical, Computer Engineering, Applied Physic\Skills or a related STEM field.
Must be a fast learner capable of researching new topics.
Must have the ability to solve problems independently.
Must also be a good communicator and capable of working as part of a team as often the problems involve several groups (S/W, H/W and process).
The ability to project plan and prioritize your work is essential.
Some aptitude for scripting/programming - with some practical experience of any language - Python/C#/SQL... or similar.
Data analysis to solve problems (Pivots, SQL, Power Bi and JMP.) would be an advantage.
Practical experience of debug and problem solving under time constraints.
Moderate knowledge of statistics.
An understanding of micro-electronics / Semiconductor physics is helpful.
Understanding of AI and willingness to implement AI into Sort processes is an advantage.

Other Criteria:

Candidate must also be able to commit to travel on international assignments if required.

Job Type:

College Grad

Shift:

Shift 1 (Ireland)

Primary Location:

Ireland, Leixlip

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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WPM Ireland Module Process Engineer

Job Description