MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.

MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.

Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!

Job Purpose
Project Manager and Technical lead for MMIC (GaAs, GaN, Si, SOI) package development and volume production manufacturing, supporting new product introductions from concept through production release. This individual will provide direction to product and design engineers for optimum, cost-effective packaging solutions including thermal and mechanical design/analysis. Package types include overmolded, leadframe-based packages, laminate packages, ceramic packages and metal packages for RF and Microwave assemblies. This individual may be required to manage/lead multiple new product packaging development programs in parallel to delivering packaging solutions on schedule for high volume, high mix manufacturing.

Main Duties and Responsibilities
• Major Project Technical lead for developing RF and Microwave packaging solutions.
• Work with internal Product Design, QA, Reliability, Supply chain and external suppliers to develop, apply and qualify the appropriate packaging technologies and assembly processes, with focus on cost, high volume manufacturability, yield and quality.
• Work with Design Engineering, Program Management and Material Planning to plan and establish Engineering Build Requirements and Qualification Build Requirements for new product introductions.
• Work with vendors and internal engineering resources to establish and update design rules for packaging.
• Team-lead in performing packaging design reviews to ensure adherence to Design-for-Manufacture guidelines.
• Contribute to establishing and implementing robust assembly processes internally and at contract manufacturers.
• Provide supplier benchmarking and tracking data to drive backend technology roadmaps.
• Working with Quality organization, characterize failure modes and analyze as a function of packaging materials and processes. Troubleshoot packaging and assembly defects, then define and implement corrective actions.
• Team-lead in Design/Development of tooling for high volume, high mix processes.
• Team-lead in establishing application notes for new packages.

Key Competencies Required
• MS +6 or BS +8 years of experience in Materials Science, EE or ME with advanced IC package process development and design with emphasis on RF and Microwave assemblies.
• Comprehensive knowledge of high-volume RFIC and Microwave IC assembly processes (die attach, flip chip, wafer saw, wire bond, surface mount, package singulation, molding, etc.)
• Proven track record of successfully driving package design/development/characterization activities from concept to implementation. Strong understanding of relationship between materials and package performance.
• Demonstrated ability to lead independent process development efforts and provide suppliers direction by working with design, assembly, and quality organizations
• Experience in working with high volume and mixed volume manufacturing operations around the globe.
• Comprehensive knowledge of product characterization, testing, quality and reliability, including compliance testing and certification [JEDEC, IPC, EIA, RoHS, WEEE, Mil-Standards]
• Experience in process troubleshooting, failure analysis and Six Sigma methodologies (Process mapping, C&E, PFMEA, DOE, SPC)
• Ability to lead projects under tight deadlines, with strong ownership of projects
• Ability to work effectively in a multi-project mode
• Good written and verbal communication skills. Able to present ideas, design concepts, data and plans with high confidence at team meetings and business group review meetings
• Good teamwork skills in working together to achieve goals
• Experience with AutoCAD and/or Solidworks is required
• Experience with solving steady state and dynamic thermal and mechanical problems, using finite element analysis (FEA) is a plus
• Experience using Minitab or Jump is a plus
• Fluent with Microsoft Office products.
• International travel required
• Fluency in spoken and written English

RFIC Packaging (Mechanical) Engineer

Job Description